Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling

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Application: Home Appliance
Cooling System: Water Cooling
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  • Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
  • Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
  • Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
  • Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
  • Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
  • Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
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  • Overview
  • Product Description
  • Main Products
  • Company Profile
  • Certifications
  • Exhibitions
  • Our Partners
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
VIL-LC-0304
Technical Class
Continuous Wave Laser
Applicable Material
Ceramic Substrate
Structure Type
Gantry Type
Laser Classification
Gaseous Laser
Laser Technology
Galvanometer Scanning Cutting
Positioning Accuracy
±2um
Laser Type
Galvanometer
Power Supply
220V
Machining Accuracy
±0.02mm
Transport Package
Wooden
Specification
1000*1200*1650mm
Trademark
Vilaser
Origin
China

Packaging & Delivery

Package Size
1000.00cm * 1200.00cm * 1650.00cm
Package Gross Weight
2000.000kg

Product Description

Product Description
Automated Ceramic Substrate Laser Cutting Machine - VIL-LC0304
Introducing the cutting-edge ceramic substrate and FPCB circuit substrate laser cutting machine from Shenzhen Vilaser Equipment Co., Ltd., which harnesses the power of a 355nm wavelength laser to deliver unparalleled automatic micro-precision cutting and drilling capabilities. This marvel of engineering features state-of-the-art auto-focusing and automated loading/unloading systems. Its impressive specifications include a cutting depth of less than 2mm, a minimum drilling aperture of 0.2mm, and an efficient cutting speed ranging from 50 to 250mm/s. Ideal for high-power electronics modules and a variety of other advanced applications, it boasts automated dual-head, dual-platform processing for maximum productivity.
Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
Key Advantages
  • 1. Built upon a sturdy marble structure that ensures unparalleled high precision and stability, this machine stands as a paragon of durability and accuracy.

    2. Our innovative combination of linear motors, guides, and linear encoders facilitates fully closed-loop control, allowing the machine to achieve remarkable high speed and precision simultaneously. This results in negligible wear and an impressive service life.

    3. With a meticulously designed fully sealed laser and external optical path, it effectively prevents dust ingress, significantly extending the lens lifespan and minimizing maintenance frequency.

    4. Our optional software offers automatic laser power detection and compensation capabilities. It can be seamlessly integrated with hardware to automatically detect, compensate, and correct laser power, thus minimizing and potentially eliminating the adverse effects of laser head power attenuation (Optional).

    5. Experience excellence with our proprietary software, which seamlessly integrates various laser, motion, control, and technological know-how into one comprehensive solution.

    6. Elevate automation by adding an automatic loading/unloading mechanism to manual equipment, achieving a level of automated production that removes the need for manual intervention (Optional).

TECHNICAL PARAMETERS
Parameter Specification
Model VIL-LC304
Max Laser Power 10W / 15W / 20W / 30W (selectable)
Laser Wavelength 355nm
Beam Quality (M²) <1.5
Repetition Frequency 20-80kHz
Standard Marking Area 110 × 110mm
Optional Marking Area Up to 300 × 300mm
Marking Depth ≤0.4mm
Marking Speed <1000mm/s
Minimum Line Width 0.1mm
Minimum Character Size 0.15mm
Repeat Accuracy ±0.01mm
Power Consumption 3KW
Power Supply 220V/50Hz/7A
Cooling System water-Cooled
Dimensions (L×W×H) 1000*1200*1650mm
Equipment Structure
 
Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
 
Laser generator system
  • The galvanometer scanning system consists of an optical scanner and servo control, providing high-speed digital processing for excellent, distortion-free marking results.
Working Platform

· A perforated positioning arrangement, compact structure, and flexible product position adjustment, facilitating convenient processing.
Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling Laser generator system

·High system resolution, ensuring uniform and excellent light sensitivity.
Elevation Measurement System

User-friendly rotary lifting wheel for flexible adjustment of the laser cutting focal length.
Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling Red Light Positioning

Red light focusing and positioning function, eliminating the need for caliper measurement; accurate laser cutting is achieved by aligning two points.
APPLICATIONS
This machine is primarily designed for precision cutting and drilling applications within the circuit board industry. It shines in executing precision cutting and drilling of PCB, FPCB, and ceramic circuit boards, including intricate LTCC and HTCC green tape drilling and cavity cutting. Additionally, it excels in ceramic sheet drilling, contour cutting, blind slot machining, FPC coverlay windowing, and contour cutting of both rigid-flex and rigid boards, making it an indispensable tool for advanced manufacturing processes.
Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
 

Why Choose ViLaser?
  • Our commitment to excellence is underscored by our ISO-certified R&D and production processes, ensuring the highest standards in quality and reliability.
  • Enjoy the peace of mind that comes with 24/7 global technical support, ready to assist whenever you need it.
  • Benefit from our customizable configurations, tailored to meet unique workflows and enhance operational efficiency.
Transform your production line with ViLaser's renowned laser welding expertise, a proven asset in driving innovation and productivity.
Contact us for OEM/ODM solutions and let us help you achieve your production goals with tailored solutions that fit your needs.
Main Products
Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
Our exemplary array of products includes state-of-the-art laser welding equipment, advanced laser marking machinery, precision laser cutting tools, cutting-edge precision laser drilling instruments, and sophisticated automation equipment. These versatile innovations are designed to enhance a wide spectrum of industries. From the ever-evolving consumer electronics sector to the essential appliance industry, encompassing washing machines, air conditioners, and refrigerators, our solutions are indispensable. They also find critical applications in the realm of automotive electronics, the intricate world of electrical circuit boards, and the forefront of semiconductor packaging devices. Furthermore, our products are integral to the optical communication industry, vital motor core components, and the precision-driven medical device sector, among others. Discover the seamless integration of precision and innovation with Shenzhen Vilaser Equipment Co., Ltd.
Company Profile

Automated Laser Cutting Machine for High-Precision Ceramic Substrate DrillingViLaser Established in 2014, ViLaser has carved a niche in the realm of laser soldering technology, with a decade-long expertise that sets us apart in the industry.
Celebrated as a national high-tech enterprise, ViLaser boasts complete autonomy from research and development to production. Our expansive facility spans an impressive 3800 square meters and is complemented by 4 strategic branches across East and Southwest China. With an innovative team exceeding 60+ R&D and technical experts, we proudly operate a sophisticated and reliable supply chain system.

Automated Laser Cutting Machine for High-Precision Ceramic Substrate DrillingOur commitment to excellence is reflected in our exhaustive technical support and responsive after-sales service, encompassing parameter optimization, meticulous equipment maintenance, and comprehensive process training, all designed to ensure seamless production continuity for our valued customers.
Certifications
Automated Laser Cutting Machine for High-Precision Ceramic Substrate DrillingOur company prides itself on adhering to the rigorous standards of the ISO9001: 2016 quality management system, ensuring that we meet and exceed international benchmarks. With a robust portfolio of 74 patent certificates, including a remarkable 5 invention patents and 35 utility patents, we stand as one of the leading enterprises in domestic laser soldering patent research and development.
Exhibitions
Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
Our Partners
Automated Laser Cutting Machine for High-Precision Ceramic Substrate DrillingOur products have earned the trust and preference of major industry leaders across the globe. Esteemed companies such as US-based Jabil and TTI; France's renowned Valeo; Japan's innovative giants Nidec and Panasonic; and China's eminent corporations including MEDIA, GREE, Hikvision, BYD, CETC, along with Taiwan's Unimicro, are among those who have chosen our solutions for their critical operations.
Packaging & Shipping
Automated Laser Cutting Machine for High-Precision Ceramic Substrate Drilling
 

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