Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications

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Customization: Available
Axis: 4 Axis
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  • Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
  • Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
  • Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
  • Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
  • Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
  • Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
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  • Overview
  • Product Description
  • Main Products
  • Company Profile
  • Certifications
  • Exhibitions
  • Our Partners
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
VIL-LWMB-CS2
Control
Automatic
Application
Electrical & Electronics Industry, Lighting Industry, Auto Industry, Communication Industry
Certification
ISO
Laser Power
50W / 75W / 100W (Selectable)
Laser Wavelength
1064nm
Cooling Mode
Full Air-Cooled
OEM
Available
Tin Ball Diameter
50-200um
Processing Efficiency
≈3 Balls/S
Process Mode
Ball Bonding
Transport Package
Wooden
Specification
1030 × 1245 × 1680mm
Trademark
ViLaser
Origin
China

Packaging & Delivery

Package Size
140.00cm * 140.00cm * 186.00cm
Package Gross Weight
2000.000kg

Product Description

Product Description
Double Station Laser Tin Ball Soldering Machine
Introducing the state-of-the-art VIL-LWB-CS2 Double Station Laser Tin Ball Soldering Machine by ViLaser-a revolutionary solution engineered for high-precision soldering tasks with cutting-edge accuracy. Perfectly crafted for microelectronic components, this sophisticated machine merges advanced fiber laser technology with an innovative dual-station interactive feeding system, ensuring pinnacle efficiency and precision. Tailored for BGA chips, 5G optical communication devices, camera modules, and semiconductor packaging, it delivers immaculate, spatter-free, and residue-free welding with unparalleled consistency.
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
Key Features
  • Dual Workstations: Experience seamless productivity with simultaneous loading/unloading and welding operations, dramatically reducing downtime and elevating productivity by 20% or more.
  • CCD Positioning System: Experience precision like never before with a ±3μm repeat accuracy, ensuring flawless alignment on ultra-fine solder joints.
  • Automated Tin Ball Spraying: Perfectly synchronizes laser welding with precise ball dispensing, accommodating pad sizes from 60-2000μm.
  • Customizable Options: Offers expanded functionality with post-weld inspection, dust purification, and customizable enhancements to meet your specific needs.
  • No Flux Required: Say goodbye to cleaning costs with a design that enhances environmental friendliness by eliminating the need for flux.
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
TECHNICAL PARAMETERS
Parameter Specification
Model VIL-LWMB-CS2
Laser Power 50W ~100W  (selectable)
Laser Wavelength 1064nm
Cooling Mode Full air-cooled
Tin Ball Diameter 60-200μm
Control System PC + dedicated software
Positioning Mode CCD vision system
Repeat Accuracy ±3μm
Soldering Range    200 × 200mm
Processing Speed ≈3 balls/second
Power Supply AC220V, 50Hz
Operating Environment 22-30°C, 20-70% RH (non-condensing)
Weight 1200kg
Dimensions (L × W × H) 1030 × 1245 × 1680mm
PRODUCT DETAILS 
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
CCD Vision Positioning System

Equipped with a high-definition CCD camera and a comprehensive full-vision image positioning system, providing 360° intelligent recognition and positioning. Automatically captures custom welding paths, adaptable to a myriad of shapes, with flexible X-Y-Z motion trajectory programming that significantly boosts processing efficiency and precision.
Laser with Temperature Feedback

Employs a fiber laser module coupled with a high-precision temperature feedback control system. This technology ensures temperature regulation in minute areas (0.3-1.5mm diameter) with an accuracy of ±10°C, guaranteeing optimal welding results and safeguarding workpiece integrity.
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
Precision Worktable

Boasts an efficient and precise dual-Y structure worktable with a remarkable ±7μm motion repeat accuracy, offering stability and consistency in batch production through meticulous motion control.
Solder Ball Placement Mechanism

Features a high-precision solder ball placement mechanism, meticulously controlled via program settings and nozzle selection, expertly managing the rate and amount of solder balls to achieve precise solder joint sizing.

 
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
Post-Welding Inspection

Offers expandability to include solder dispensing and post-welding inspection for thorough defect detection after the soldering process, ensuring quality assurance (optional).
APPLICATIONS
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
Constant Temperature Laser Welding ---- Pioneering the development of next-generation communication products while ensuring unparalleled quality and performance.

Laser and Inert Gas Interaction ---- Skillfully melts solder balls and injects them into pads, ensuring strong and reliable welding.

Laser Welding in Connector Industry ---- Plays an essential role in the connector industry, offering robust solutions for intricate challenges.

Laser Welding Characteristics ---- Expertly addresses welding challenges in compact and unique motors, providing reliable solutions.

Selective Laser Welding System ---- Perfectly suited for microelectronics connector applications, enhancing precision and reliability.

Main Applications
Ideal for IT electronics, the digital industry, PCB socket components, optoelectronic products, sensors, mobile phones, digital cameras, camera modules, and other high-precision component welding needs.

Specific Uses
Perfect for coil soldering, socket component soldering, connector bases, medical cameras, and camera modules, ensuring uncompromised quality and performance.


Why Choose ViLaser?
As a National High-tech Enterprise 4cbbaf36
Main Products
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
Our flagship offerings include an impressive array of cutting-edge laser welding equipment, state-of-the-art laser marking equipment, and precision-engineered laser cutting and drilling equipment. Each piece of machinery is crafted to perfection to serve the sophisticated demands of automation equipment across a multitude of industries. Our technology seamlessly integrates with a wide range of consumer electronics, enhancing the efficiency of the appliance sector-spanning washing machines, air conditioners, and refrigerators. Additionally, our innovations extend to automotive electronics and electrical circuit boards, as well as semiconductor packaging devices and optical communication instruments. Our expertise further encompasses motor core components and the realm of precision medical devices, ensuring unparalleled performance and reliability in every application we cater to.
Company Profile

Laser Automatic Ball Bonder for High-Quality BGA Packaging ApplicationsViLaser Founded in the innovative year of 2014, ViLaser has dedicated over a decade to mastering the intricate art of laser soldering technology, establishing itself as a leader in this cutting-edge field.
As a proud and distinguished national high-tech enterprise, ViLaser maintains complete independence and control over every step of its operations, from pioneering research and development to seamless production. Our expansive facility spans an impressive 3800 square meters, supporting our 4 strategic branches located in the dynamic regions of East and Southwest China. With a robust team of over 60 passionate and skilled R&D and technical professionals, ViLaser boasts a sophisticated and efficient supply chain system, ensuring excellence and innovation in laser technology solutions.

Laser Automatic Ball Bonder for High-Quality BGA Packaging ApplicationsWe are committed to delivering unparalleled technical support and responsive after-sales service. Our comprehensive offerings include precise parameter debugging, meticulous equipment maintenance, and in-depth process training, all designed to ensure the seamless continuity of our customers' production and the ultimate satisfaction of their operational needs.
Certifications
Laser Automatic Ball Bonder for High-Quality BGA Packaging ApplicationsIn our unwavering commitment to excellence, Shenzhen Vilaser Equipment Co., Ltd. adheres rigorously to the esteemed ISO9001: 2016 quality management system, ensuring our operations meet and exceed international standards. Boasting an impressive portfolio of 74 patent certificates, we lead the industry with 5 groundbreaking invention patents and 35 utility patents. As one of the foremost pioneers in domestic laser soldering patent research and development, we continuously push the boundaries of innovation.
Exhibitions
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications
Our Partners
Laser Automatic Ball Bonder for High-Quality BGA Packaging ApplicationsOur products proudly grace the portfolios of some of the world's most notable companies. We are delighted to collaborate with esteemed partners including: US-based Jabil and TTI; France's innovative leader, Valeo; Japan's industrial giants, Nidec and Panasonic; as well as China's trailblazers: MEDIA, GREE, Hikvision, BYD, CETC. Additionally, we have forged strong ties with Taiwan's Unimicro, among others. With each partnership, we strengthen our global footprint and continue to deliver excellence.
 
Packaging & Shipping
Laser Automatic Ball Bonder for High-Quality BGA Packaging Applications

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