± 0.01mm High-Precision Cutting and Drilling Capabilities Automated Ceramic Substrate Laser Cutting Machine

• Customization: Available
• Application: Home Appliance
• Cooling System: Water Cooling
• Model NO.: VIL-LC-0304
• Technical Class: Continuous Wave Laser
• Applicable Material: Ceramic Substrate
• Structure Type: Gantry Type
• Laser Classification: Gaseous Laser
• Laser Technology: Galvanometer Scanning Cutting
• Positioning Accuracy: ±2um
• Laser Type: Galvanometer
• Power Supply: 220V
• Machining Accuracy: ±0.02mm
• Transport Package: Wooden
• Specification: 1000*1200*1650mm
• Trademark: Vilaser
• Origin: China
• Package Size: 1000.00cm * 1200.00cm * 1650.00cm
• Package Gross Weight: 2000.000kg

Product Description

Product Description

Automated Ceramic Substrate Laser Cutting Machine - VIL-LC0304

The ceramic substrate and FPCB circuit substrate laser cutting machine utilizes a 355nm wavelength laser, enabling automatic micro-precision cutting and drilling functions. Equipped with auto-focusing and automatic loading/unloading systems, it supports a cutting depth of <2mm, a minimum drilling aperture of 0.2mm, and a cutting speed of 50-250mm/s. Suitable for high-power power electronics modules,  and other fields, it supports automated dual-head, dual-platform processing.

Key Advantages

• 1.  Marble structure provides the foundation for high precision and stability.

  2.  Linear motors + guides + linear encoders enable fully closed-loop control, achieving high speed and high precision simultaneously, with no wear and long service life.

  3.  Fully sealed laser and external optical path design prevents dust ingress, extending lens lifespan and reducing maintenance frequency.

  4.  Optional software supports automatic laser power detection and compensation. Can be paired with hardware for automatic detection, compensation, and correction of laser power to minimize/eliminate the effects of laser head power attenuation (Optional).

  5.  Excellent proprietary software integrates various laser, motion, control, and know-how comprehensively.

  6.  Adds automatic loading/unloading mechanism to the manual loading/unloading equipment to achieve automated production without manual intervention (Optional).

TECHNICAL PARAMETERS

Parameter	Specification
Model	VIL-LC304
Max Laser Power	10W / 15W / 20W / 30W (selectable)
Laser Wavelength	355nm
Beam Quality (M²)	<1.5
Repetition Frequency	20-80kHz
Standard Marking Area	110 × 110mm
Optional Marking Area	Up to 300 × 300mm
Marking Depth	≤0.4mm
Marking Speed	<1000mm/s
Minimum Line Width	0.1mm
Minimum Character Size	0.15mm
Repeat Accuracy	±0.01mm
Power Consumption	3KW
Power Supply	220V/50Hz/7A
Cooling System	water-Cooled
Dimensions (L×W×H)	1000*1200*1650mm

Equipment Structure

	Laser generator system The galvanometer scanning system consists of an optical scanner and servo control, providing high-speed digital processing for excellent, distortion-free marking results.
Working Platform · A perforated positioning arrangement, compact structure, and flexible product position adjustment, facilitating convenient processing.
	Laser generator system ·High system resolution, ensuring uniform and excellent light sensitivity.
Elevation Measurement System User-friendly rotary lifting wheel for flexible adjustment of the laser cutting focal length.
	Red Light Positioning Red light focusing and positioning function, eliminating the need for caliper measurement; accurate laser cutting is achieved by aligning two points.

APPLICATIONS

Primarily used for precision cutting and drilling in the circuit board industry; including precision cutting/drilling of PCB/FPCB/ceramic circuit boards, such as LTCC/HTCC green tape drilling and cavity cutting; ceramic sheet drilling, contour cutting, blind slot machining; FPC coverlay windowing and contour cutting; rigid-flex board and rigid board contour cutting, etc.

 

Why Choose ViLaser?

• ISO-certified R&D and production processes.
• 24/7 global technical support.
• Customizable configurations for unique workflows.

Elevate your production line with ViLaser's proven laser welding expertise.
for OEM/ODM solutions.
 

Main Products

Our main products are laser welding equipment, laser marking equipment, precision laser cutting equipment, precision laser drilling equipment, and automation equipment. It is used for various consumer electronics products, appliance industry such as washing machine and air conditioner refrigerator, automotive electronics products, electrical circuit boards, semiconductor packaging devices, optical communication devices, motor core components, precision medical devices and other industries.

Company Profile

ViLaser was founded in 2014 and has been specializing in the application of laser soldering technology for over ten years.
As a national high-tech enterprise, ViLaser is independently controllable throughout the entire process from research and development to production. The factory covers an area of 3800 square meters and has 4 branches in East China and Southwest China; More than 60+R&D and technical personnel, with a mature supply chain system.
The company provides comprehensive technical support and after-sales response, including parameter debugging, equipment maintenance, and process training, to ensure customer production continuity.

Certifications

The company strictly follows the ISO9001: 2016 quality management system according to meet international standard,and has 74 patent certificates, including 5 invention patents and 35 utility patents,is one of the most domestic laser soldering patent research and development enterprises.

Exhibitions

Our Partners

Our products are sold to major companies around the world, such as: US Jabil and TTI; France Valeo ; Japan Nidec and Panasonic; and China's leading enterprise: MEDIA, GREE, Hikvision, BYD, CETC as well as Taiwa Unimicro ,etc.

Packaging & Shipping